PHOTOSENSITIVE RESIN COMPOSITION

PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring enhanced photosensitivity and resolution and giving a cured coating excellent in resistance to electroless gold plating. SOLUTION: The photosensitive resin composition contains (A-1) a modified copolymer obtained...

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1. Verfasser: DAIKO YOSHIKAZU
Format: Patent
Sprache:eng
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APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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creator DAIKO YOSHIKAZU
description PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring enhanced photosensitivity and resolution and giving a cured coating excellent in resistance to electroless gold plating. SOLUTION: The photosensitive resin composition contains (A-1) a modified copolymer obtained by adding the epoxy group of an alicyclic epoxy group- containing unsaturated compound to part of the acid groups of a copolymer comprising (a) β-carboxyethyl acrylate, (b) an acid group-containing unsaturated compound and (c) a (meth)acrylic ester and (B) at least one monomer selected from the group comprising acetoacetoxyethyl acrylate, acryloylmorpholine and tetrahydrofurfuryl acrylate or contains a modified copolymer obtained by adding the epoxy group of an alicyclic epoxy group-containing unsaturated compound to part of the acid groups of a copolymer comprising the monomers (a), (b), (c) and (B) and further contains (C) a resin having two or more unsaturated groups in one molecule and a cyclic skeleton and curable with active energy beams, (D) a diluent and (E) a photopolymerization initiator.
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SOLUTION: The photosensitive resin composition contains (A-1) a modified copolymer obtained by adding the epoxy group of an alicyclic epoxy group- containing unsaturated compound to part of the acid groups of a copolymer comprising (a) β-carboxyethyl acrylate, (b) an acid group-containing unsaturated compound and (c) a (meth)acrylic ester and (B) at least one monomer selected from the group comprising acetoacetoxyethyl acrylate, acryloylmorpholine and tetrahydrofurfuryl acrylate or contains a modified copolymer obtained by adding the epoxy group of an alicyclic epoxy group-containing unsaturated compound to part of the acid groups of a copolymer comprising the monomers (a), (b), (c) and (B) and further contains (C) a resin having two or more unsaturated groups in one molecule and a cyclic skeleton and curable with active energy beams, (D) a diluent and (E) a photopolymerization initiator.</description><edition>7</edition><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020118&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002014466A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20020118&amp;DB=EPODOC&amp;CC=JP&amp;NR=2002014466A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DAIKO YOSHIKAZU</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION</title><description>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring enhanced photosensitivity and resolution and giving a cured coating excellent in resistance to electroless gold plating. 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subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CHEMISTRY
CINEMATOGRAPHY
COMPOSITIONS BASED THEREON
ELECTROGRAPHY
HOLOGRAPHY
MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS
MATERIALS THEREFOR
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
THEIR PREPARATION OR CHEMICAL WORKING-UP
title PHOTOSENSITIVE RESIN COMPOSITION
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