PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a photosensitive resin composition capable of ensuring enhanced photosensitivity and resolution and giving a cured coating excellent in resistance to electroless gold plating. SOLUTION: The photosensitive resin composition contains (A-1) a modified copolymer obtained by adding the epoxy group of an alicyclic epoxy group- containing unsaturated compound to part of the acid groups of a copolymer comprising (a) β-carboxyethyl acrylate, (b) an acid group-containing unsaturated compound and (c) a (meth)acrylic ester and (B) at least one monomer selected from the group comprising acetoacetoxyethyl acrylate, acryloylmorpholine and tetrahydrofurfuryl acrylate or contains a modified copolymer obtained by adding the epoxy group of an alicyclic epoxy group-containing unsaturated compound to part of the acid groups of a copolymer comprising the monomers (a), (b), (c) and (B) and further contains (C) a resin having two or more unsaturated groups in one molecule and a cyclic skeleton and curable with active energy beams, (D) a diluent and (E) a photopolymerization initiator.