ELECTROCONDUCTIVE RESIN PASTE COMPOSITION AND SEMICONDUCTOR DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide an electroconductive resin paste composition suppressing the separation of the resin from the electroconductive filler, and having little dispersion in discharging, and a semiconductor device using the electroconductive resin paste composition. SOLUTION: The electroc...

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Bibliographische Detailangaben
Hauptverfasser:	KAWASUMI MASAO, KATAYAMA YOJI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroconductive resin paste composition suppressing the separation of the resin from the electroconductive filler, and having little dispersion in discharging, and a semiconductor device using the electroconductive resin paste composition. SOLUTION: The electroconductive resin paste composition contains (A) an acrylic ester compound or a methacrylic ester compound, (B) a radical initiator and (C) an electroconductive filler prepared by silver-plating of the surfaces of carbon beads. The semiconductor device is produced by adhering semiconductor elements to a supporting member with the electroconductive resin paste composition and subsequently blocking them.