METHOD FOR MANUFACTURING HEAT DISSIPATION STRUCTURE

PROBLEM TO BE SOLVED: To provide a method for manufacturing at low cost with high reproducibility a heat dissipation structure, with which semiconductor components can be bonded without impairing heat dissipation property even for fluxless case. SOLUTION: The method for manufacturing a heat dissipat...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SUGIMOTO ISAO, UTO MANABU, SAKAWA MORIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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