METHOD FOR MANUFACTURING HEAT DISSIPATION STRUCTURE

PROBLEM TO BE SOLVED: To provide a method for manufacturing at low cost with high reproducibility a heat dissipation structure, with which semiconductor components can be bonded without impairing heat dissipation property even for fluxless case. SOLUTION: The method for manufacturing a heat dissipation structure comprises a first step, where a ceramic circuit-board having at least an aluminum circuit on the front and a metal plate on the back is brazed to a copper heatsink through a brazing filler metal, and a second step, where a nickel layer is coated on the area of the heatsink except the surface the brazing filler metal is bonded to and an aluminum circuit surface on the ceramic circuit-board.