ELECTROSTATIC CHUCK APPARATUS

PROBLEM TO BE SOLVED: To eliminate holding failures caused by the temperature fluctuation of a wafer when the wafer is held by an electrostatic chuck. SOLUTION: A voltage is applied to an electrode of the electrostatic chuck for sucking a semiconductor substrate, and this applied voltage is controll...

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Bibliographische Detailangaben
1. Verfasser:	HAGI KIMIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT CONVERSION OR DISTRIBUTION OF ELECTRIC POWER DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION MACHINE TOOLS MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To eliminate holding failures caused by the temperature fluctuation of a wafer when the wafer is held by an electrostatic chuck. SOLUTION: A voltage is applied to an electrode of the electrostatic chuck for sucking a semiconductor substrate, and this applied voltage is controlled so as to fluctuate in stages by a voltage control part.