MOLD RELEASE FILM

PROBLEM TO BE SOLVED: To provide a mold release film having good resin retentivity in the case of laminating a plurality of layers of laminates having via holes through a prepreg and good heat resistance at a low cost. SOLUTION: The mold release film is used in a step of pressing the prepreg at a co...

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Bibliographische Detailangaben
Hauptverfasser:	HAYASHI MASUFUMI, TAIMA KAZUO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MAKING GRANULES OR PREFORMS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PREPARATION OR PRETREATMENT OF THE MATERIAL TO BESHAPED PRINTED CIRCUITS RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIALCONTAINING PLASTICS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mold release film having good resin retentivity in the case of laminating a plurality of layers of laminates having via holes through a prepreg and good heat resistance at a low cost. SOLUTION: The mold release film is used in a step of pressing the prepreg at a copper-clad laminate manufacturing time. The mold release film comprises a mold release layer provided on one side surface or both side surfaces of a polyester foamed film. The release layer is preferred to be formed by treating the layer with a silicone mold release agent.