MANUFACTURING METHOD OF POWDER COATED WIRE AND ITS APPARATUS

PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of manufacturing coated wire having no pin holes or no mixture of air in a coated film, a smooth surface, minimized diameter variation in the longitudinal direction and coated film thickness in the circumferential direction, at a hig...

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Bibliographische Detailangaben
1. Verfasser: MORIMITSU MASAYUKI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method and an apparatus capable of manufacturing coated wire having no pin holes or no mixture of air in a coated film, a smooth surface, minimized diameter variation in the longitudinal direction and coated film thickness in the circumferential direction, at a high manufacturing speed. SOLUTION: After the surface of wire is processed in a rough state, the wire is heated, and, in the state where a thermal plastic resin is made to adhere to the heated wire, and the thermal plastic resin starts melting, the wire is made to pass through two stepped dies having a diameter approximately larger than the diameter of the wire. Thermal plastic resin filled up in a gap between the wire outer diameter and the inner diameter of dies is pressed and drawn.