SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE

SUBSTRATE FOR MOUNTING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT DEVICE

PROBLEM TO BE SOLVED: To correctly cut a base substrate of a substrate for mounting an electronic component and to correctly surely mounting the substrate for mounting an electronic component on an external electric circuit. SOLUTION: An arithmetical mean roughness of the bottom surface of an insula...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: FURUMOTO YUICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To correctly cut a base substrate of a substrate for mounting an electronic component and to correctly surely mounting the substrate for mounting an electronic component on an external electric circuit. SOLUTION: An arithmetical mean roughness of the bottom surface of an insulating substrate 1 is made about from 0.1 μm to 0.4 μm to prevent the peripheral portion of an electrode pad 6 from bleeding out. An arithmetical mean roughness of the top surface of the insulating substrate 1 is made about from 0.5 μm to 1.0 μm to increase the adhering force of a resin covering member 7 covering an electronic component 2 to the insulating substrate 1.