POLISHING DEVICE

PROBLEM TO BE SOLVED: To provide a polishing device for precision flatness, despite the presence of recessed parts and protruding parts on the surface of a semiconductor device. SOLUTION: A semiconductor wafer 201 is polished with an abrasive 505, supplied to a polishing surface 504 of a turntable 5...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	SHIGETA ATSUSHI, YAJIMA HIROMI, YANO HIROYUKI, AOKI RIICHIRO, KODERA MASAKO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polishing device for precision flatness, despite the presence of recessed parts and protruding parts on the surface of a semiconductor device. SOLUTION: A semiconductor wafer 201 is polished with an abrasive 505, supplied to a polishing surface 504 of a turntable 502. The turntable 502 and shafts 517 and 518 which rotate a wafer support part 501 are provided with strain sensors 551 and 552 comprising a strain gauge and the like for detecting the strain of the shafts 517 and 518. The shafts 517 and 518 are connected to motors 511 and 512 via belts 519 and 520. A load, generated by friction between the polishing surface 504 and the wafer 201, under the driving force of the motors 511 and 512, imparts strains at the shafts 517 and 518. The strain sensors 551 and 552, using the strain gauge and the like, convert the amount of strain into an electrical signal.