FORMED POLYURETHANE FOR ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT COATED THEREWITH

PROBLEM TO BE SOLVED: To provide light formed polyurethane whose thickness is made almost equal in which the height (coat thinness) of a form can be easily adjusted even when this polyurethane is molded by open mold without damaging the original characteristics (moisture-proofness, water resistance,...

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Bibliographische Detailangaben
Hauptverfasser:	NAKAJO NORIAKI, SAEGUSA YOSHIFUSA, HAMAKAWA ETSUZO, TAKAGI KAZUHISA
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide light formed polyurethane whose thickness is made almost equal in which the height (coat thinness) of a form can be easily adjusted even when this polyurethane is molded by open mold without damaging the original characteristics (moisture-proofness, water resistance, insulating performance, and impact absorbency or the like) of the polyurethane, and a method for manufacturing electronic components coated with the formed polyurethane, and a printed circuit board coated with the formed polyurethane. SOLUTION: This formed polyurethane whose forming magnification ranges from 1.1 to 2.5 times in an independent air-bubble type is, desirably, formed as the molded body of polyurethane compositions including a micro-balloon constituted by including forming agent in the hollow of a hollow sphere.