ELECTRONIC PARTS

PROBLEM TO BE SOLVED: To provide electronic parts which can smoothly move a slidable object without resistance even when the board thickness of a case is thick. SOLUTION: The electronic parts are provided with a substrate 20 on which slide contact patterns 23 and 25 are formed, the slidable object 3...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KAWASAKI TAIU, NAKAGOME KAZUTAKA
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide electronic parts which can smoothly move a slidable object without resistance even when the board thickness of a case is thick. SOLUTION: The electronic parts are provided with a substrate 20 on which slide contact patterns 23 and 25 are formed, the slidable object 30 placed on the substrate 20, a slider 40 attached to the object 30, and a case 60 which is put on the substrate 30 and fixed by bending pawls 67 installed to the lower sides of the case 60 to the back side of a mount 10 provided on the bottom side of the substrate 20. Relieving sections 71 which prevent the bent corner sections 69 of the pawls 67 from pushing up the mount 10 by coming into contact with the mount 10 are installed to the bent corner sections 69. The relieving sections 71 are formed by reducing the thicknesses of the bent corner sections 69 of the pawls 67.