TRANSPARENT GAS BARRIER LAMINATED FILM AND METHOD FOR MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a gas barrier film capable of preventing the flaw caused by the dust adhering to the surface of a base material film in a base material film manufacturing process or the dust attracted to the surface of the base material film in a vacuum tank, where an inorganic comp...

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Bibliographische Detailangaben
Hauptverfasser:	NIIJIMA TETSUYA, NOGUCHI NAOKO, MIYAMOTO TAKASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL CONDUCTORS DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY PERFORMING OPERATIONS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a gas barrier film capable of preventing the flaw caused by the dust adhering to the surface of a base material film in a base material film manufacturing process or the dust attracted to the surface of the base material film in a vacuum tank, where an inorganic compound layer is vapor- deposited on the base material film, by the charge of the base material film, the flaw caused by a lubricant added to the base material film and the flaw caused by the charge of the inorganic compound vapor-deposited film due to secondary electrons and the are discharge thereof. SOLUTION: In the gas barrier laminated film wherein the inorganic compound layer is provided on at least the single surface of the base material film, the inorganic compound layer is formed by laminating a transparent conductive oxide layer and a gas barrier layer comprising either one of or both of aluminum oxide and silicon oxide on the surface of the base material film so that the transparent conductive oxide layer is formed on the surface of the base material film.