METHOD FOR MANUFACTURING PRINTED-WIRING BOARD, AND BOARD MANUFACTURED THEREBY
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board that is efficient while the relationship between drilling conditions and finishing state is stable, and a printed-wiring board that is manufactured by the method. SOLUTION: In the method for manufacturing a printed wir...
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| creator | KAWAKAMI YUTAKA TSUBOMATSU YOSHIAKI INOUE FUMIO OHATA HIROTO SHIMIZU AKIRA NAMATAME KAZUHIKO AWANO YASUHIKO |
| description | PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board that is efficient while the relationship between drilling conditions and finishing state is stable, and a printed-wiring board that is manufactured by the method. SOLUTION: In the method for manufacturing a printed wiring board, a hole is etched to form an opening in a copper-clad laminate or a substrate by heating/compressing for integrating a laminate of an inner layer circuit, an insulating layer and a copper film. Thereafter, the exposed insulating layer on the opening is transpired by laser beam. The opening is bored after the laser beam is irradiated at an area inapplicable to the printed wiring board. A printed-wiring board is obtained by the manufacturing method. |
| format | Patent |
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SOLUTION: In the method for manufacturing a printed wiring board, a hole is etched to form an opening in a copper-clad laminate or a substrate by heating/compressing for integrating a laminate of an inner layer circuit, an insulating layer and a copper film. Thereafter, the exposed insulating layer on the opening is transpired by laser beam. The opening is bored after the laser beam is irradiated at an area inapplicable to the printed wiring board. A printed-wiring board is obtained by the manufacturing method.</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20011130&DB=EPODOC&CC=JP&NR=2001332836A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20011130&DB=EPODOC&CC=JP&NR=2001332836A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KAWAKAMI YUTAKA</creatorcontrib><creatorcontrib>TSUBOMATSU YOSHIAKI</creatorcontrib><creatorcontrib>INOUE FUMIO</creatorcontrib><creatorcontrib>OHATA HIROTO</creatorcontrib><creatorcontrib>SHIMIZU AKIRA</creatorcontrib><creatorcontrib>NAMATAME KAZUHIKO</creatorcontrib><creatorcontrib>AWANO YASUHIKO</creatorcontrib><title>METHOD FOR MANUFACTURING PRINTED-WIRING BOARD, AND BOARD MANUFACTURED THEREBY</title><description>PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board that is efficient while the relationship between drilling conditions and finishing state is stable, and a printed-wiring board that is manufactured by the method. 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SOLUTION: In the method for manufacturing a printed wiring board, a hole is etched to form an opening in a copper-clad laminate or a substrate by heating/compressing for integrating a laminate of an inner layer circuit, an insulating layer and a copper film. Thereafter, the exposed insulating layer on the opening is transpired by laser beam. The opening is bored after the laser beam is irradiated at an area inapplicable to the printed wiring board. A printed-wiring board is obtained by the manufacturing method.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| language | eng |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR MANUFACTURING PRINTED-WIRING BOARD, AND BOARD MANUFACTURED THEREBY |
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