METHOD FOR MANUFACTURING PRINTED-WIRING BOARD, AND BOARD MANUFACTURED THEREBY

PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board that is efficient while the relationship between drilling conditions and finishing state is stable, and a printed-wiring board that is manufactured by the method. SOLUTION: In the method for manufacturing a printed wir...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAKAMI YUTAKA, TSUBOMATSU YOSHIAKI, INOUE FUMIO, OHATA HIROTO, SHIMIZU AKIRA, NAMATAME KAZUHIKO, AWANO YASUHIKO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed-wiring board that is efficient while the relationship between drilling conditions and finishing state is stable, and a printed-wiring board that is manufactured by the method. SOLUTION: In the method for manufacturing a printed wiring board, a hole is etched to form an opening in a copper-clad laminate or a substrate by heating/compressing for integrating a laminate of an inner layer circuit, an insulating layer and a copper film. Thereafter, the exposed insulating layer on the opening is transpired by laser beam. The opening is bored after the laser beam is irradiated at an area inapplicable to the printed wiring board. A printed-wiring board is obtained by the manufacturing method.