PLATING DEVICE AND PLATING METHOD

PLATING DEVICE AND PLATING METHOD

PROBLEM TO BE SOLVED: To provide a plating device and plating method which exhibit the performance, such as a plating film thickness distribution, equal to or higher than that of the conventional system by providing a plating tank which is simple the structure of the plating tank by taking advantage...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: EGUCHI TAKEYA, KATSUYAMA KUNIO, SHIINA HIROMI, SUGANO RYUICHI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a plating device and plating method which exhibit the performance, such as a plating film thickness distribution, equal to or higher than that of the conventional system by providing a plating tank which is simple the structure of the plating tank by taking advantage of a single sheet shielding plate system, is short and compact in length and is simple in the work for controlling and regulating the film thickness distribution. SOLUTION: This plating device has the plating tank and is pendently provided with an anode plate 7 in the plating tank 1. An object to be plated 8 is pendently disposed to face the anode plate and a sheet of the shielding plate 11 having an aperture 30 is disposed between the anode plate 7 and cathode holder 9 in the plating liquid in the plating tank. The opening area of this aperture is made adjustable.