WAFER ALIGNMENT DEVICE

PROBLEM TO BE SOLVED: To provide a wafer alignment device which automatically aligns wafers with their prescribed positions. SOLUTION: A wafer alignment device 3 comprises a rotating mechanism, a rocking mechanism and a tilting mechanism. The rotating mechanism holds a wafer 1 to its center in a predetermined position, detects the center of a V notch 10, rotates the wafer 1 around its center on the horizontal plane, and aligns the center of the V notch 10 at a predetermined position. The rocking mechanism rocks the wafer 1 around the wafer perpendicular line passing through the center of the V notch 10 on the horizontal plane. The tilting mechanism declines the wafer 1 around the wafer tangent passing through the center of the V notch 10 as a center of rotation and retains the wafer 1. At least either one of the rocking mechanism or the tilting mechanism is characteristically provided on the wafer alignment device 3.