SEMICONDUCTOR PRODUCTION DEVICE AND SEMICONDUCTOR PRODUCTION METHOD

PROBLEM TO BE SOLVED: To provide a device and method for semiconductor production capable of improving uniformness of electrolytic grinding in the face of a substrate to be processed. SOLUTION: Load is dispatched to a metallic layer of a substrate to be processed on which the metallic layer is formed through a plurality of needle bodies electrically kept in contact with the metallic layer and currents flowing in the electrolyte are collected through the load dispatching. Even when grinding reaches the under face of the metallic layer at a part of region, grinding is carried out by other needle bodies in other regions. Hence, a metal to be removed is not unevenly left in a special region. Further, the pressure at which the needle bodies touch the metallic layer is detected and the needle bodies are moved in the substantially vertical direction to the substrate face to be processed to make the detected pressure constant. The surface of the substrate to be processed is prevented from being damaged due to the needle bodies by controlling the contact pressure of the plural needle bodies with the metallic layer to make it constant. In this way, a high quality electrolytic grinding can be realized without flaws on the substrate surface to be processed.