ELECTRONIC STRUCTURE INCLUDING METAL INTERLOCK STRUCTURE AND ITS FORMATION

PROBLEM TO BE SOLVED: To provide an electronic structure having a conductive plating layer where adhesion of plating is enhanced. SOLUTION: A substrate having a metal sheet in a dielectric layer is used. The metal sheet contains a metal, e.g. copper. An opening, e.g. a blind via, is made in the subs...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	JOHN S KURESUGE, KASCHAK RONALD A, DONS FRANCIS J JR, MATIENZO LUIS J, ADVOCATE JR GERALD G, VAN HART DANIEL C
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic structure having a conductive plating layer where adhesion of plating is enhanced. SOLUTION: A substrate having a metal sheet in a dielectric layer is used. The metal sheet contains a metal, e.g. copper. An opening, e.g. a blind via, is made in the substrate by laser drilling passing through a part of the dielectric layer and the metal sheet. Surface (blind surface) beneath the opening includes a metal protrusion formed by laser drilling and the metal protrusion is integrated with the blind surface. The metal protrusion contains the metal of the metal sheet and at least one component from the dielectric layer. Subsequently, the metal protrusion is etched to form a metal interlock structure integral with a part of the blind surface. A conductive metal is stuck into the opening including the metal interlock structure by plating.