ASSEMBLING APPARATUS FOR SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an assembling apparatus for a semiconductor device which allows a collective bonding of a plurality of semiconductor chips on the surface of a solid-state device even if the semiconductor chips have different thicknesses. SOLUTION: The assembler comprises stages 201-204 having placement faces 201a-204a to place slave chips 101-104, a suction collet 400 having a suction face 400a for holding a master chip which is disposed face to face with the stages, and an elevation mechanism 410 for bonding the master chip 100 and the slave chips 101-104, The placement faces 201a-204a of the stages 201-204 can be adjusted in height by height adjustment screws 211-214.