APPARATUS AND METHOD FOR PLASMA TREATMENT

PROBLEM TO BE SOLVED: To provide a method and an apparatus for plasma treatment by which a base material can be treated in a flat condition without any curl by the vacuum film deposition method (the sputtering method) when a conductive film for forming the wiring is deposited on both sides of the ba...

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Bibliographische Detailangaben
1. Verfasser:	TAKEI SHIGEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOIDCHEMISTRY CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION THEIR RELEVANT APPARATUS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method and an apparatus for plasma treatment by which a base material can be treated in a flat condition without any curl by the vacuum film deposition method (the sputtering method) when a conductive film for forming the wiring is deposited on both sides of the base material, and the conductive film is surely deposited in a through hole portion (a hole) when forming a connection portion in the through hole portion (the hole) of the small diameter. SOLUTION: The plasma treatment apparatus which excites the plasma in a vessel, and having plasma treatment units 110, 120, 130 each in a sheet shape and simultaneously performing the plasma treatment in the plasma from both sides of a work 180 which is formed of a laminate with an insulator, a conductor or a combination thereof and continuous in a strip, comprises the vessel to perform the plasma treatment, a gas feed system, an exhaust system, counter electrodes and a high frequency power source, and performs the plasma treatment while applying the high frequency of the phase opposite to each other to one and the other of the counter electrodes facing each other.