COOLING APPARATUS

PROBLEM TO BE SOLVED: To provide a cooling apparatus capable of realizing a high cooling efficiency without requiring a large occupied space. SOLUTION: A power transistor module 11 is fixed on the surface of a flange plate 22 of a heat sink 21 and on the surface of a connection flat plate 32 of a he...

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Bibliographische Detailangaben
Hauptverfasser:	TAKIZAWA HISAAKI, OUCHI YOSHIHIKO, OSHIMORI TAKAO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooling apparatus capable of realizing a high cooling efficiency without requiring a large occupied space. SOLUTION: A power transistor module 11 is fixed on the surface of a flange plate 22 of a heat sink 21 and on the surface of a connection flat plate 32 of a heat pipe 3 fitted with a recessed part 222 formed on the flange plate 22. After being conducted to the connection flat plate 32, heat is conducted to opposing flat plates 31 extending along recessed parts 231 and 241 through slits 221. The heat from the opposing flat plates 31 travels to opposing wall parts 23 and 24 of the heat sink 21, and then, is actively dissipated from heat dissipation fins 28.