METHOD OF FORMING CURVE WIRE

METHOD OF FORMING CURVE WIRE

PROBLEM TO BE SOLVED: To obtain a curve wire which has a shape of high quality and stability, without being affected by back tension imposed on it. SOLUTION: As shown in Figure 3 (a), a pin-shaped wire 10 is formed by a wire-bonding device. As shown in Figure 3 (c), the pin-shaped wire 10 is inserte...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: TAMAI HIDEAKI, KOMACHI YASUYUKI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To obtain a curve wire which has a shape of high quality and stability, without being affected by back tension imposed on it. SOLUTION: As shown in Figure 3 (a), a pin-shaped wire 10 is formed by a wire-bonding device. As shown in Figure 3 (c), the pin-shaped wire 10 is inserted into a capillary 4, and the capillary is moved to conform to the shape of a curve wire 11 that is to be formed as shown in Figures 3 (d) to (j), by which the curve wire 11 is formed.