APPARATUS FOR TREATING SUBSTRATE

PROBLEM TO BE SOLVED: To provide an apparatus for treating a wafer, in which corrosion of waste fluid passage and leakage of ozone gas can be prevented by removing ozone from used solution containing ozone. SOLUTION: Multiple balls 33 of aluminum oxide are contained in an ozone decomposition chamber...

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Bibliographische Detailangaben
1. Verfasser:	HAYASHI TOKUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an apparatus for treating a wafer, in which corrosion of waste fluid passage and leakage of ozone gas can be prevented by removing ozone from used solution containing ozone. SOLUTION: Multiple balls 33 of aluminum oxide are contained in an ozone decomposition chamber 31 and a detour 43, such that they do not impede conduction of used solution. Used solution discharged from a treating unit 2 touches the surface of aluminum oxide balls 33 to decompose ozone contained in the used solution efficiently. Consequently, highly reactive ozone scarcely remain in the used solution discharged from a discharge section 36.