CONDUCTIVE THIN FILM DEPOSITION MATERIAL

PROBLEM TO BE SOLVED: To provide a conductive thin film deposition material in which the content of alpha radiation sources causing soft errors is reduced and the content is controlled. SOLUTION: A total dose of alpha rays from the alpha radiators in the conductive thin film deposition material cons...

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Bibliographische Detailangaben
Hauptverfasser:	KIN YUTAKA, MITSUZU TOSHIAKI, NAKAYAMA KOJI, KUROIWA YOICHI, NAKAJIMA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a conductive thin film deposition material in which the content of alpha radiation sources causing soft errors is reduced and the content is controlled. SOLUTION: A total dose of alpha rays from the alpha radiators in the conductive thin film deposition material consisting of aluminum, copper, silver or gold or alloys thereof are reduced to