EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC DEVICE
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moisture resistant adhesive and low stress properties, and an electronic device having high reliability (moisture resistance and thermal impulse resistance) which has elements sealed with this composition. SOLUT...
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| creator | TSUCHIDA SATORU KOSAKA MASAHIKO OGATA MASAJI |
| description | PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moisture resistant adhesive and low stress properties, and an electronic device having high reliability (moisture resistance and thermal impulse resistance) which has elements sealed with this composition. SOLUTION: The epoxy resin composition for sealing comprises (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler, and the electronic device has elements sealed with this epoxy resin composition. |
| format | Patent |
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SOLUTION: The epoxy resin composition for sealing comprises (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler, and the electronic device has elements sealed with this epoxy resin composition.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20011002&DB=EPODOC&CC=JP&NR=2001270976A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20011002&DB=EPODOC&CC=JP&NR=2001270976A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUCHIDA SATORU</creatorcontrib><creatorcontrib>KOSAKA MASAHIKO</creatorcontrib><creatorcontrib>OGATA MASAJI</creatorcontrib><title>EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC DEVICE</title><description>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moisture resistant adhesive and low stress properties, and an electronic device having high reliability (moisture resistance and thermal impulse resistance) which has elements sealed with this composition. 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| language | eng |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC DEVICE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T11%3A34%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TSUCHIDA%20SATORU&rft.date=2001-10-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2001270976A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |