EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moisture resistant adhesive and low stress properties, and an electronic device having high reliability (moisture resistance and thermal impulse resistance) which has elements sealed with this composition. SOLUT...

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Bibliographische Detailangaben
Hauptverfasser:	TSUCHIDA SATORU, KOSAKA MASAHIKO, OGATA MASAJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing having excellent moisture resistant adhesive and low stress properties, and an electronic device having high reliability (moisture resistance and thermal impulse resistance) which has elements sealed with this composition. SOLUTION: The epoxy resin composition for sealing comprises (A) a liquid epoxy resin, (B) a curing agent containing a liquid aromatic amine, (C) rubber particles, and (D) an inorganic filler, and the electronic device has elements sealed with this epoxy resin composition.