METHOD OF MANUFACTURING MULTILAYER BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board which can minimize the thickness dispersion of a lower insulating layer. SOLUTION: This is a manufacturing method compresses a process of manufacturing a protective film molded item 33 10-5 μm in thickness by repeating the process of applying an insulating material containing photosetting resin and an inorganic material on a supporting substrate 1 and drying it once or more times, a process of forming a stacked molded item where a plurality of insulating layer molded items 71a-71f containing photosetting resin and an inorganic material are stacked on the surface of the protective film molded item 33, a process of removing the supporting substrate 31, and a process of baking the stacked molded item where the protective molded item 33 is made.