METHOD OF MANUFACTURING THERMOELECTRIC CONVERSION MODULE

PROBLEM TO BE SOLVED: To provide a bonding method of electrically bonding the end faces of a bismuth-tellurium thermoelectric element with a low thermal/electrical resistance at the bond zone at an improved bond yield and a method of manufacturing a thermoelectric conversion module having a high den...

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Bibliographische Detailangaben
Hauptverfasser: KUSHIBIKI KEIKO, MAKUCHI YUTAKA
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a bonding method of electrically bonding the end faces of a bismuth-tellurium thermoelectric element with a low thermal/electrical resistance at the bond zone at an improved bond yield and a method of manufacturing a thermoelectric conversion module having a high density and a low loss in the thermoelectric conversion performance. SOLUTION: The method of manufacturing a thermoelectric conversion module 6 having at least a pair of p- and n-type thermoelectric elements 2, 4 electrically bonded with electrode layers 5 at the mutually opposite end faces of the thermoelectric elements 2, 4, comprises a step of bonding end face metal layers 3 composed of Cu or Al plates to the end faces of the thermoelectric elements 2, 4 containing a bismuth-tellurium type compound as a main component by the ultrasonic welding method.