METHOD OF FORMING ALIGNMENT MARK

PROBLEM TO BE SOLVED: To make an alignment mark produceable without requiring much labor and, at the same time, surely detectable by means of a measuring apparatus. SOLUTION: A contact hole 4 and an alignment groove 5 are formed through an insulating layer 2 by etching the layer 2 until the bottoms...

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Bibliographische Detailangaben
Hauptverfasser:	EBERTSEDER EVA, PAHLITZSCH JURGEN, LEHR MATTHIAS, WERNEKE TORSTEN, HANEBECK JOCHEN
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To make an alignment mark produceable without requiring much labor and, at the same time, surely detectable by means of a measuring apparatus. SOLUTION: A contact hole 4 and an alignment groove 5 are formed through an insulating layer 2 by etching the layer 2 until the bottoms of the hole 4 and groove 5 reach a first metallic layer 3, and a metal 6 is caused to deposit in the groove 5 and hole 4. Continuously, the surface of the metal 6 is caused to subside within the positioned extent of the groove 5 by the CMP method, so as to form a profile for the alignment mark formed on a second metallic layer 9 caused to deposit on the insulating layer 2.