POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition which satisfies heat resistance, adhesion and low dielectric properties and can form a good image. SOLUTION: The positive type photosensitive resin composition comprises (A) an organic solvent-soluble polyimide having...

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Bibliographische Detailangaben
Hauptverfasser:	YAMAOKA TSUGIO, UEMITSU TATSUYOSHI, NAKANO TSUNETOMO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a positive type photosensitive resin composition which satisfies heat resistance, adhesion and low dielectric properties and can form a good image. SOLUTION: The positive type photosensitive resin composition comprises (A) an organic solvent-soluble polyimide having an acid group, (B) a diethyl vinyl ether which imparts low dielectric properties and (C) a photo-acid generating agent. A coating of the photosensitive resin composition is irradiated with UV through a mask and the irradiated part is leached with an aqueous alkali solution to obtain a positive type heat resistant relief.