CAPSULED ELECTRONIC CIRCUIT, PRODUCING METHOD THEREFOR AND ELECTRONIC DEVICE
PROBLEM TO BE SOLVED: To provide an improved method for generally capsuling a power source and an exothermic electronic component. SOLUTION: A capsuled electronic circuit 100 is provided for holding an electronic circuit 110 having an exothermic component inside a case 120 partially surrounding this...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an improved method for generally capsuling a power source and an exothermic electronic component. SOLUTION: A capsuled electronic circuit 100 is provided for holding an electronic circuit 110 having an exothermic component inside a case 120 partially surrounding this electronic circuit at least. As one advantageous form, the capsuled electronic circuit 100 provides a heat-conductive insert 130 located just closely to the exothermic component 115 inside the case. This insert 130 increases heat conductivity from the electronic circuit 110 to the case 120. |
---|