FILM MOLDING SYSTEM AND METHOD FOR CONTROLLING SET CONDITIONS

PROBLEM TO BE SOLVED: To efficiently cut a short labor hour for the change of arrangements and prevent an error in the set conditions from occurring, in a film molding system. SOLUTION: The set conditions for temperature in a mold part, the set conditions for slit width in the molten resin discharge...

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Bibliographische Detailangaben
Hauptverfasser:	KOBAYASHI KAZUYOSHI, NAKASONE YUICHI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To efficiently cut a short labor hour for the change of arrangements and prevent an error in the set conditions from occurring, in a film molding system. SOLUTION: The set conditions for temperature in a mold part, the set conditions for slit width in the molten resin discharge part of the mold part and the set conditions for line velocity, film coat thickness, coat width and the like, are kept in storage in compliance with every molding. Further, when some set conditions are selected from among a plurality of the described set conditions, the set conditions corresponding to the selected set conditions are collectively established.