METHOD FOR WET SURFACE TREATMENT OF COMPONENT HAVING MICROPORE

PROBLEM TO BE SOLVED: To provide a cleaning method for efficiently removing a polymer removing liquid remaining inside micropores at a step to clean an electronic component having micropores. SOLUTION: This method for cleaning the electronic component comprises a step to remove the polymer produced at a step to form micropores 7 by bringing the electronic component into contact with the polymer removing liquid and a step to remove the polymer removing liquid remaining inside the micropores by bringing the electronic component, which is heated to a prescribed temperature, into contact with a treating liquid having the boiling point lower than the prescribed temperature of the electronic component. In the latter step, bubbles are generated in the treating liquid to produce the convection current of the treating liquid on the surface of the electronic component as shown in Fig. 1 so that the polymer removing liquid remaining inside the micropores 7 can be removed in a short time.