CHIP RESISTOR AND CHIP ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a chip resistor which is unlikely to drop out from a mounting substrate, when heat generates in a resistive element. SOLUTION: This chip resistor comprises an insulation substrate 21, a plurality of connection electrodes 25 formed on an upper face of the insulation s...

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Bibliographische Detailangaben
Hauptverfasser: KINOSHITA TAIJI, HOSHITOKU SEIJI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a chip resistor which is unlikely to drop out from a mounting substrate, when heat generates in a resistive element. SOLUTION: This chip resistor comprises an insulation substrate 21, a plurality of connection electrodes 25 formed on an upper face of the insulation substrate 21, and a resistive element 30 for electrically connecting these connection electrodes 25 to each other. A holding electrode 29, which is not electrically connected to the resistive element 30 and the connection electrode 25, is provided in the insulation substrate 21.