CONNECTION SHEET FOR CONTACT WITH CONTACT BUMPS OF SEMICONDUCTOR COMPONENT

PROBLEM TO BE SOLVED: To obtain a connection sheet for contact with the contact bumps of a semiconductor component in which a sufficient contact pressure is ensured between contact pads arranged on the sheet and the contact bumps. SOLUTION: A slot 5 having a constant opening width is made to penetrate an insulation sheet 2 while dividing a contact pad 4 being brought into contact with a contact bump 3 of a semiconductor component. Opposite ends of the slot 5 are extended to a part 2a of the insulation sheet contiguous to the contact pad 4. Each piece 2b of the insulation sheet and each piece 4a of the contact pad divided by the slot 5 can be displaced to the direction of upper and lower surfaces of the sheet 2 on the left and right of the slot.