EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in normal-temperature storage stability, quick curability, and fluidity. SOLUTION: This composition essentially comprises (A) an epoxy resin, (B) a phenol resin, (C) a molecular associate formed...

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Bibliographische Detailangaben
1. Verfasser: OKI HIROMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SEMICONDUCTOR DEVICES
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor sealing which is excellent in normal-temperature storage stability, quick curability, and fluidity. SOLUTION: This composition essentially comprises (A) an epoxy resin, (B) a phenol resin, (C) a molecular associate formed from a tetrasubstituted phosphonium (X), a compound (Y) having at least two phenolic hydroxyl groups, and a conjugated base of the compound (Y) having at least two phenolic hydroxyl groups provided the conjugated base is a phenoxide compound formed by removing one hydrogen atom from the compound (Y) having at least two phenolic hydroxyl groups, (D) tetraphenylphosphonium tetra(1-naphthoyloxy) borate, and (E) an inorganic filler. The equivalent ratio of epoxy groups of the epoxy resin to phenolic hydroxyl groups of the phenol resin is 0.5-2. The inorganic filler (E) is compounded in an amount of 200-2,400 pts.wt. based on 100 pts.wt. sum of the epoxy and phenol resins.