ELECTROLESS-PLATABLE HIGHLY HEAT RESISTANT EPOXY RESIN COMPOSITION, INSULATION MATERIAL FOR BUILDUP USING IT AND BUILDUP BASE PLATE

PROBLEM TO BE SOLVED: To provide an electroless platable highly heat resistant epoxy resin composition which shows excellent heat resistance and enables roughening treatment by means of a prior art, an insulation material for buildup using it and a build-up wiring plate. SOLUTION: An epoxy resin com...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NIIMOTO HARUKI, IMAIZUMI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!