ELECTROLESS-PLATABLE HIGHLY HEAT RESISTANT EPOXY RESIN COMPOSITION, INSULATION MATERIAL FOR BUILDUP USING IT AND BUILDUP BASE PLATE

PROBLEM TO BE SOLVED: To provide an electroless platable highly heat resistant epoxy resin composition which shows excellent heat resistance and enables roughening treatment by means of a prior art, an insulation material for buildup using it and a build-up wiring plate. SOLUTION: An epoxy resin com...

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Bibliographische Detailangaben
Hauptverfasser:	NIIMOTO HARUKI, IMAIZUMI MASAHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electroless platable highly heat resistant epoxy resin composition which shows excellent heat resistance and enables roughening treatment by means of a prior art, an insulation material for buildup using it and a build-up wiring plate. SOLUTION: An epoxy resin composition contains a polyfunctional epoxy resin having 3 or more functional groups in a molecule (a), a curing agent (b) and a phenolic hydroxyl group-containing polyamide (c), each as an essential component and the cured material of the composition has a glass transition temperature (Tg) of not lower than 180 deg.C measured by a TMA method.