FLEXIBLE PRINTED BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a flexible printed board (FPC) which is improved in elasticity and heat resistance without sacrificing a flexibility. SOLUTION: The FPC is made by laminating a base film 11, base film-side adhesive layer 12, metal foil layer 13 which constitutes a patterns circuit, c...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	OKADA KENICHI, TANABE NOBUO, ARAI MASAHIKO, JUMONJI SADAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Schreiben Sie den ersten Kommentar!