FLEXIBLE PRINTED BOARD AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a flexible printed board (FPC) which is improved in elasticity and heat resistance without sacrificing a flexibility. SOLUTION: The FPC is made by laminating a base film 11, base film-side adhesive layer 12, metal foil layer 13 which constitutes a patterns circuit, c...

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Bibliographische Detailangaben
Hauptverfasser:	OKADA KENICHI, TANABE NOBUO, ARAI MASAHIKO, JUMONJI SADAMITSU
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a flexible printed board (FPC) which is improved in elasticity and heat resistance without sacrificing a flexibility. SOLUTION: The FPC is made by laminating a base film 11, base film-side adhesive layer 12, metal foil layer 13 which constitutes a patterns circuit, coverlay-side adhesive layer 14, and coverlay film 15 in this order. A crossliking density on the side of the adhesive layers 12, 14 near and around the metal foil layer 13 is made larger than the other parts. As a result, without sacrificing a flexibility of the entire FPC, elasticity and heat resistance of the FPC can be improved.