PARTIAL PLATING METHOD

PARTIAL PLATING METHOD

PROBLEM TO BE SOLVED: To provide a partial plating method where a plating jig such as a mask is not necessary, plating can be conducted on a desired part with good position precision, plating can be conducted with good productivity by continuously making a material to be plated pass direction, and t...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: ISHIMATSU KENJI
Format: Patent
Sprache:eng
Schlagworte:
APPARATUS THEREFOR
BASIC ELECTRIC ELEMENTS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a partial plating method where a plating jig such as a mask is not necessary, plating can be conducted on a desired part with good position precision, plating can be conducted with good productivity by continuously making a material to be plated pass direction, and the side leakage of plating liquid is not present at all. SOLUTION: In the method for partially plating the desired part of the material to be plated, the material to be plated 1 is coated with resist 8 to which plating liquid does not correspond and the resist 8 of the part where plating is required in the coated material to be plated is removed by laser irradiation. The removed part is plated 9 and other resist 8 is removed.