METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER
PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A...
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| creator | TAKANO SHIGETO KANDA KAZUTAKA UEDA SHIZUYO WATANABE RYOICHI |
| description | PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A, 5A or 6A element of the periodic table in a vessel 5c in a manner to make a surface 1a of the diamond 1 contact with the powder. The vessel containing the diamond and the metallic powder is evacuated and heated at a temperature above the level to form a metal carbide layer on the surface of the diamond and below the melting point of the metallic powder to form a metallized layer having a thickness of 0.01-10 #×m and composed of a metal carbide layer or a metal carbide layer and a metal layer on the surface of the diamond. At least a part of the outermost layer is bonded with other substrate material with a soldering material. After bonding the diamond to the substrate material, a part of the metallized layer is removed to expose a part of the diamond and obtain a cutting tool. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2001220251A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2001220251A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2001220251A3</originalsourceid><addsrcrecordid>eNrjZEj0dQ3x8HdRcPMPUgAyHX18PKMcQzz9_RT83RRcPB19_f1cdOAyri4wMYUAx6AQBUcgA4sciHAFyfg6uQbxMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNDIyMDI1NDR2OiFAEA6NYzow</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER</title><source>esp@cenet</source><creator>TAKANO SHIGETO ; KANDA KAZUTAKA ; UEDA SHIZUYO ; WATANABE RYOICHI</creator><creatorcontrib>TAKANO SHIGETO ; KANDA KAZUTAKA ; UEDA SHIZUYO ; WATANABE RYOICHI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A, 5A or 6A element of the periodic table in a vessel 5c in a manner to make a surface 1a of the diamond 1 contact with the powder. The vessel containing the diamond and the metallic powder is evacuated and heated at a temperature above the level to form a metal carbide layer on the surface of the diamond and below the melting point of the metallic powder to form a metallized layer having a thickness of 0.01-10 #×m and composed of a metal carbide layer or a metal carbide layer and a metal layer on the surface of the diamond. At least a part of the outermost layer is bonded with other substrate material with a soldering material. After bonding the diamond to the substrate material, a part of the metallized layer is removed to expose a part of the diamond and obtain a cutting tool.</description><edition>7</edition><language>eng</language><subject>ARTIFICIAL STONE ; BASIC ELECTRIC ELEMENTS ; CEMENTS ; CERAMICS ; CHEMISTRY ; COMBINED OPERATIONS ; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS ; CONCRETE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LIME, MAGNESIA ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; OTHER WORKING OF METAL ; PERFORMING OPERATIONS ; REFRACTORIES ; SEMICONDUCTOR DEVICES ; SLAG ; TRANSPORTING ; TREATMENT OF NATURAL STONE ; UNIVERSAL MACHINE TOOLS</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010814&DB=EPODOC&CC=JP&NR=2001220251A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010814&DB=EPODOC&CC=JP&NR=2001220251A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKANO SHIGETO</creatorcontrib><creatorcontrib>KANDA KAZUTAKA</creatorcontrib><creatorcontrib>UEDA SHIZUYO</creatorcontrib><creatorcontrib>WATANABE RYOICHI</creatorcontrib><title>METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER</title><description>PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A, 5A or 6A element of the periodic table in a vessel 5c in a manner to make a surface 1a of the diamond 1 contact with the powder. The vessel containing the diamond and the metallic powder is evacuated and heated at a temperature above the level to form a metal carbide layer on the surface of the diamond and below the melting point of the metallic powder to form a metallized layer having a thickness of 0.01-10 #×m and composed of a metal carbide layer or a metal carbide layer and a metal layer on the surface of the diamond. At least a part of the outermost layer is bonded with other substrate material with a soldering material. After bonding the diamond to the substrate material, a part of the metallized layer is removed to expose a part of the diamond and obtain a cutting tool.</description><subject>ARTIFICIAL STONE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CEMENTS</subject><subject>CERAMICS</subject><subject>CHEMISTRY</subject><subject>COMBINED OPERATIONS</subject><subject>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</subject><subject>CONCRETE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LIME, MAGNESIA</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>OTHER WORKING OF METAL</subject><subject>PERFORMING OPERATIONS</subject><subject>REFRACTORIES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SLAG</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF NATURAL STONE</subject><subject>UNIVERSAL MACHINE TOOLS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2001</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEj0dQ3x8HdRcPMPUgAyHX18PKMcQzz9_RT83RRcPB19_f1cdOAyri4wMYUAx6AQBUcgA4sciHAFyfg6uQbxMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjAwNDIyMDI1NDR2OiFAEA6NYzow</recordid><startdate>20010814</startdate><enddate>20010814</enddate><creator>TAKANO SHIGETO</creator><creator>KANDA KAZUTAKA</creator><creator>UEDA SHIZUYO</creator><creator>WATANABE RYOICHI</creator><scope>EVB</scope></search><sort><creationdate>20010814</creationdate><title>METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER</title><author>TAKANO SHIGETO ; KANDA KAZUTAKA ; UEDA SHIZUYO ; WATANABE RYOICHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2001220251A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2001</creationdate><topic>ARTIFICIAL STONE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CEMENTS</topic><topic>CERAMICS</topic><topic>CHEMISTRY</topic><topic>COMBINED OPERATIONS</topic><topic>COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS</topic><topic>CONCRETE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LIME, MAGNESIA</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>OTHER WORKING OF METAL</topic><topic>PERFORMING OPERATIONS</topic><topic>REFRACTORIES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SLAG</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF NATURAL STONE</topic><topic>UNIVERSAL MACHINE TOOLS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKANO SHIGETO</creatorcontrib><creatorcontrib>KANDA KAZUTAKA</creatorcontrib><creatorcontrib>UEDA SHIZUYO</creatorcontrib><creatorcontrib>WATANABE RYOICHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKANO SHIGETO</au><au>KANDA KAZUTAKA</au><au>UEDA SHIZUYO</au><au>WATANABE RYOICHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER</title><date>2001-08-14</date><risdate>2001</risdate><abstract>PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A, 5A or 6A element of the periodic table in a vessel 5c in a manner to make a surface 1a of the diamond 1 contact with the powder. The vessel containing the diamond and the metallic powder is evacuated and heated at a temperature above the level to form a metal carbide layer on the surface of the diamond and below the melting point of the metallic powder to form a metallized layer having a thickness of 0.01-10 #×m and composed of a metal carbide layer or a metal carbide layer and a metal layer on the surface of the diamond. At least a part of the outermost layer is bonded with other substrate material with a soldering material. After bonding the diamond to the substrate material, a part of the metallized layer is removed to expose a part of the diamond and obtain a cutting tool.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | ARTIFICIAL STONE BASIC ELECTRIC ELEMENTS CEMENTS CERAMICS CHEMISTRY COMBINED OPERATIONS COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDINGMATERIALS CONCRETE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LIME, MAGNESIA MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY OTHER WORKING OF METAL PERFORMING OPERATIONS REFRACTORIES SEMICONDUCTOR DEVICES SLAG TRANSPORTING TREATMENT OF NATURAL STONE UNIVERSAL MACHINE TOOLS |
| title | METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER |
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