METHOD FOR METALLIZATION OF DIAMOND, METALLIZED DIAMOND PART AND METALLIZED DIAMOND MONDED MEMBER

PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A...

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Hauptverfasser: TAKANO SHIGETO, KANDA KAZUTAKA, UEDA SHIZUYO, WATANABE RYOICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a diamond metallizing method easily forming a uniform metallized layer high in adhesion at a low cost independent of the shape of the diamond and dispensing with complicate procedures. SOLUTION: A diamond 1 is placed or embedded in the metallic powder 2 of a group 4A, 5A or 6A element of the periodic table in a vessel 5c in a manner to make a surface 1a of the diamond 1 contact with the powder. The vessel containing the diamond and the metallic powder is evacuated and heated at a temperature above the level to form a metal carbide layer on the surface of the diamond and below the melting point of the metallic powder to form a metallized layer having a thickness of 0.01-10 #×m and composed of a metal carbide layer or a metal carbide layer and a metal layer on the surface of the diamond. At least a part of the outermost layer is bonded with other substrate material with a soldering material. After bonding the diamond to the substrate material, a part of the metallized layer is removed to expose a part of the diamond and obtain a cutting tool.