RESIST REMOVING SOLUTION COMPOSITION, REMOVING METHOD AND CIRCUIT BOARD

PROBLEM TO BE SOLVED: To provide an excellent photoresist removing solution composition which brings no residue on removal and does not cause corrosion to a metallic thin film part, and to provide a removing method using the composition and a circuit board produced by the method. SOLUTION: The resis...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YOKOYAMA YASUAKI, MOCHIZUKI ISAMU, IGARASHI KATSUTOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an excellent photoresist removing solution composition which brings no residue on removal and does not cause corrosion to a metallic thin film part, and to provide a removing method using the composition and a circuit board produced by the method. SOLUTION: The resist removing solution composition contains 0.05-20 wt.% at least one compound selected from the group comprising monohydric alcohols each having a methoxy group and glycols each having a molecular weight of