MOUNTING METHOD OF SEMICONDUCTOR BARE CHIP

PROBLEM TO BE SOLVED: To provide a method for improving the packaging density because planar arrangement only is possible when semiconductor bare chips are mounted on a board. SOLUTION: Electrode patterns which are conformed to two kinds of semiconductor bare chip mounting are formed dually on a wir...

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Bibliographische Detailangaben
Hauptverfasser:	KAWAMATA TETSUJI, YAHAGI SATORU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method for improving the packaging density because planar arrangement only is possible when semiconductor bare chips are mounted on a board. SOLUTION: Electrode patterns which are conformed to two kinds of semiconductor bare chip mounting are formed dually on a wiring board, and each of the different bare chip mounting methods is enabled.