METHOD OF MANUFACTURING UNIFORM BALL OF NONLEAD SYSTEM JUNCTION MATERIAL

PROBLEM TO BE SOLVED: To provide the manufacturing method of a uniform nonlead system solder ball for realizing technology development for making a material to be harmless, after rejection through the use of the metal of high versatility which does not include lead, substituting it for other materia...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKABE SABURO, ICHIKAWA AKIO, TAKAGI TOSHIO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER
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