METHOD OF MANUFACTURING UNIFORM BALL OF NONLEAD SYSTEM JUNCTION MATERIAL

PROBLEM TO BE SOLVED: To provide the manufacturing method of a uniform nonlead system solder ball for realizing technology development for making a material to be harmless, after rejection through the use of the metal of high versatility which does not include lead, substituting it for other materials and realizing a junction, in a fine region in the mounting and jointing electronic components on/to a substrate. SOLUTION: In the manufacturing method of the uniform ball of a nonlead system junction material comprising lead, which is easily oxidized, acoustic wave energy is periodically given to melted metal where a melting temperature is controlled from a melting point to (melting point + 100 (K)) and the uniform ball can be manufactured by discharging it at the temperature difference of not more than 70 (K) with the melting temperature in an inert gas or a reducing gas or directly in a refrigerant. The method can be applied widely to granulation using the material which is easily oxidized.