METHOD OF MANUFACTURING UNIFORM BALL OF NONLEAD SYSTEM JUNCTION MATERIAL
PROBLEM TO BE SOLVED: To provide the manufacturing method of a uniform nonlead system solder ball for realizing technology development for making a material to be harmless, after rejection through the use of the metal of high versatility which does not include lead, substituting it for other materia...
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| creator | OKABE SABURO ICHIKAWA AKIO TAKAGI TOSHIO |
| description | PROBLEM TO BE SOLVED: To provide the manufacturing method of a uniform nonlead system solder ball for realizing technology development for making a material to be harmless, after rejection through the use of the metal of high versatility which does not include lead, substituting it for other materials and realizing a junction, in a fine region in the mounting and jointing electronic components on/to a substrate. SOLUTION: In the manufacturing method of the uniform ball of a nonlead system junction material comprising lead, which is easily oxidized, acoustic wave energy is periodically given to melted metal where a melting temperature is controlled from a melting point to (melting point + 100 (K)) and the uniform ball can be manufactured by discharging it at the temperature difference of not more than 70 (K) with the melting temperature in an inert gas or a reducing gas or directly in a refrigerant. The method can be applied widely to granulation using the material which is easily oxidized. |
| format | Patent |
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SOLUTION: In the manufacturing method of the uniform ball of a nonlead system junction material comprising lead, which is easily oxidized, acoustic wave energy is periodically given to melted metal where a melting temperature is controlled from a melting point to (melting point + 100 (K)) and the uniform ball can be manufactured by discharging it at the temperature difference of not more than 70 (K) with the melting temperature in an inert gas or a reducing gas or directly in a refrigerant. The method can be applied widely to granulation using the material which is easily oxidized.</description><edition>7</edition><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; POWDER METALLURGY ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2001</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010727&DB=EPODOC&CC=JP&NR=2001203444A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20010727&DB=EPODOC&CC=JP&NR=2001203444A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKABE SABURO</creatorcontrib><creatorcontrib>ICHIKAWA AKIO</creatorcontrib><creatorcontrib>TAKAGI TOSHIO</creatorcontrib><title>METHOD OF MANUFACTURING UNIFORM BALL OF NONLEAD SYSTEM JUNCTION MATERIAL</title><description>PROBLEM TO BE SOLVED: To provide the manufacturing method of a uniform nonlead system solder ball for realizing technology development for making a material to be harmless, after rejection through the use of the metal of high versatility which does not include lead, substituting it for other materials and realizing a junction, in a fine region in the mounting and jointing electronic components on/to a substrate. SOLUTION: In the manufacturing method of the uniform ball of a nonlead system junction material comprising lead, which is easily oxidized, acoustic wave energy is periodically given to melted metal where a melting temperature is controlled from a melting point to (melting point + 100 (K)) and the uniform ball can be manufactured by discharging it at the temperature difference of not more than 70 (K) with the melting temperature in an inert gas or a reducing gas or directly in a refrigerant. 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SOLUTION: In the manufacturing method of the uniform ball of a nonlead system junction material comprising lead, which is easily oxidized, acoustic wave energy is periodically given to melted metal where a melting temperature is controlled from a melting point to (melting point + 100 (K)) and the uniform ball can be manufactured by discharging it at the temperature difference of not more than 70 (K) with the melting temperature in an inert gas or a reducing gas or directly in a refrigerant. The method can be applied widely to granulation using the material which is easily oxidized.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING WORKING METALLIC POWDER |
| title | METHOD OF MANUFACTURING UNIFORM BALL OF NONLEAD SYSTEM JUNCTION MATERIAL |
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