FILM THICKNESS CONTROL METHOD

PROBLEM TO BE SOLVED: To provide a film thickness control method for completely forming and removing coating with an optimum film thickness that is formed by using vapor obtained by evaporating stock solution. SOLUTION: The average film thickness of coating is measured over a wide range by a feeler-...

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Bibliographische Detailangaben
Hauptverfasser:	ISHIWATARI OSAMU, WARATANI SHUZO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MATERIALS THEREFOR MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film thickness control method for completely forming and removing coating with an optimum film thickness that is formed by using vapor obtained by evaporating stock solution. SOLUTION: The average film thickness of coating is measured over a wide range by a feeler-type film thickness measuring instrument or the like, and at the same time the amount of main constituent of coating is analyzed, for example, by a time-of-flight secondary ion mass spectrograph, thus grasping and controlling the accurate amount of main constituent of coating.